日本日亞405nm 6868 365nm 平窗120石英玻璃片封裝 ?3D打印機固化燈

　　參數

　　電流 Forward Current 700mA

　　電壓 Forward Voltage ? 3.5-3.9V

　　電功率 Power Dissipation 3.08W

　　光功率 Radiant Flux 800mW/cm2

　　峰值波長 Peak Wavelength 405nm

　　封裝尺寸:6868 ? ?6.8*6.8*1.9 L*W*H(mm)

　　詢問中文詳細規格書可以聯系我，先看原文件截圖

　　Thermal Management

　　< The Absolute Maximum Junction Temperature (T J ) must not be exceeded under any circumstances. The increase in the

　　temperature of an LED while in operation may vary depending on the PCB thermal resistance and the density of LEDs on the PCB

　　assembly. Ensure that when using the LEDs for the chosen application, heat is not concentrated in an area and properly managed

　　in the system/assembly.

　　< The operating current should be determined by considering the temperature conditions surrounding the LED (i.e. T A ). Ensure that

　　when operating the LED, proper measures are taken to dissipate the heat.

　　< The following two equations can be used to calculate the LED junction temperature:

　　1) T J =T A +R θJA ?1?1W 2) T J =T S +R θJS ?1?1W

　　*T J =LED Junction Temperature: °C

　　T A =Ambient Temperature: °C

　　T S =Soldering Temperature (Die Heat Sink): °C

　　R θJA =Thermal Resistance from Junction to Ambient: °C/W

　　R θJS =Thermal Resistance from Junction to T S Measurement Point: °C/W